THERMALRIGHT TF9 2.9G THERMAL PASTE

Exceptional Thermal Conductivity

The Thermalright TF9 2.9g Thermal Paste boasts a thermal conductivity of 14 W/m·K, ensuring efficient heat transfer from your CPU or GPU to the heatsink. This high-performance paste is designed to meet the demands of gamers, overclockers, and professionals seeking optimal cooling solutions. ​

Broad Operating Temperature Range

Engineered to perform under extreme conditions, the TF9 maintains its stability and effectiveness across a wide temperature range from -220°C to 380°C. This makes it suitable for various applications, from high-performance computing to industrial electronics. ​

Safe and Non-Conductive

Safety is paramount with the TF9 thermal paste. It is electrically non-conductive and non-corrosive, eliminating the risk of short circuits or damage to sensitive electronic components. Additionally, it contains no metal particles, ensuring compatibility with a wide range of devices. ​

Easy Application and Long-Term Reliability

The TF9 comes in a convenient 2.9g syringe, accompanied by a spatula for precise application. Its smooth consistency allows for easy spreading, ensuring a uniform layer for optimal thermal contact. With low volatility, the paste maintains its performance over extended periods, reducing the need for frequent reapplication.